Call for Projects FY26
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Artificial Intelligence (AI) Hardware Subtopics
The Hub responds to Microelectronics Commons Calls-for-Projects in topics addressed by our expertise with AI Hardware. The FY26 call addresses the areas listed here:
- Topic 1: Innovative Architectures for High Density Memory and Computational Elements in Non-Traditional Computing
- Topic 2: Sensor and Artificial Intelligence (AI) Fusion
- Topic 3: Heterogeneous Computing Architectures for In-Hardware Learning and Non-Traditional AI/ML Capability
Learn more about this opportunity on the NSTXL website.
Submission Timeline
- November 21, 2025: CFP released and Q&A opens
- December 5, 2025: White papers are due to the Northwest-AI-Hub by 5PM PST
- Submit using the Northwest-AI-Hub White Paper Template
- December 8, 2025: White papers are ready for Review Panel to score
- December 15, 2025: Q&A closes
- December 19, 2025: All submitted white papers will be notified about the selection decision
- January 5, 2026: Revised white paper drafts are due for review by the Hub lead org (Stanford)
- Submit using the NSTXL White Paper Template
- January 6, 2026: Anticipated Q&A posted
- January 8, 2026: Lead org (Stanford) finishing reviewing the white papers
- January 12, 2026: The final white papers submitted to the sponsor by 9AM PST
Question Form
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