Call for Projects FY26
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The Hub responds to Microelectronics Commons Calls-for-Projects in topics addressed by our expertise with AI Hardware. The FY26 call addresses the areas listed here:
- Topic 1: Innovative Architectures for High Density Memory and Computational Elements in Non-Traditional Computing
- Topic 2: Sensor and Artificial Intelligence (AI) Fusion
- Topic 3: Heterogeneous Computing Architectures for In-Hardware Learning and Non-Traditional AI/ML Capability
Information below describes the Hub's white paper process for selecting projects for submission, with the approach of focusing efforts on a few, high quality proposals.